PCB Chat
By PCEA
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Category: Technology
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Episodes: 100
Description
Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
| Episode | Date |
|---|---|
|
RM 143: A Candid Conversation with Doug Pauls
|
May 20, 2024 |
|
PCB Chat 130: Audrey McGuckin on Developing Leadership Skills
|
May 11, 2024 |
|
RM 142: Live from SMTA's Pan Pacific Strategic Electronics Symposium (PanPac)
|
Apr 23, 2024 |
|
RM 141: Component Tape Splicing Best Practices
|
Apr 15, 2024 |
|
PCB Chat 129: Electronics Design Market Update with Wally Rhines
|
Apr 08, 2024 |
|
PCB Chat 128: The Latest HDP Consortium Projects
|
Mar 17, 2024 |
|
RM 139: Environmentally Responsible Alternatives to Traditional PCB Fabrication
|
Mar 14, 2024 |
|
PCB Chat 127: Matthias Wagner on AI-Based PCB Design Tools
|
Mar 12, 2024 |
|
RM 138: Hand Soldering and Rework Best Practices
|
Feb 27, 2024 |
|
RM 137: Building a Sustainable Career with a Sustainable Impact
|
Feb 20, 2024 |
|
PCB Chat 127: David Schild on US Strategy for Supply Chain Readiness
|
Feb 14, 2024 |
|
PCB Chat 126: Andrew Scheuermann on AI in Electronics
|
Feb 07, 2024 |
|
RM 136: Environmentally Responsible/Sustainable Conformal Coating
|
Jan 23, 2024 |
|
PCB Chat 125: Manny Marcano on Spinoff of Accelerated Designs
|
Jan 23, 2024 |
|
PCB Chat 124: Wally Rhines on the Latest PCB Design Software Market Data
|
Jan 12, 2024 |
|
RM 135: Zach Peterson about Board Design Best Practices
|
Jan 09, 2024 |
|
RM 134 -- 2023 Podcast Season Wrap-Up
|
Dec 26, 2023 |
|
RM 133: Novel Wireless / Wearable ESD Monitoring
|
Dec 12, 2023 |
|
PCB Chat 123: US PCB Legislation Update with David Schild of PCBAA
|
Dec 06, 2023 |
|
PCB Chat 122: Robert Feranec on PCB Design
|
Dec 05, 2023 |
|
RM 132: HZO’s Lisa Rizzo on Ultra-Thin Conformal Coating
|
Nov 29, 2023 |
|
RM 131: Industry Icon Bob Willis
|
Nov 21, 2023 |
|
PCB Chat 121: Wally Rhines on the Latest Electronics Design Software Market Data
|
Nov 03, 2023 |
|
RM 130: Human-Centered Approaches to Innovation with Dr. Alexis Abramson
|
Oct 26, 2023 |
|
RM 129: Network Reliability - Avoiding Cyber-Security Threats
|
Oct 11, 2023 |
|
PCB Chat 120: HDP’s Latest PCB and Solder Research
|
Sep 15, 2023 |
|
RM 127: Phil Zarrow and Jim Hall
|
Sep 12, 2023 |
|
RM 126: Moisture Mitigation Strategies with Dan Jenkins and Rob Lowery
|
Aug 24, 2023 |
|
RM 125: DFM Best Practices with Pride Industries’ Engineering Manager Andrew Williams
|
Aug 08, 2023 |
|
RM 124: Dave Hillman’s Amazing 3,600 Mile Kayak Journey Down the Missouri River
|
Aug 02, 2023 |
|
PCB Chat 119: David Schild on US Government Investment and Policy for PCB Manufacturing
|
Jul 27, 2023 |
|
PCB Chat 118: Claire Wemp, Ph.D., on Thermal Interface Materials
|
Jul 21, 2023 |
|
RM 123: Introduction to Highly Accelerated Life Testing (HALT) with Dr. Christopher Jackson
|
Jul 13, 2023 |
|
PCB Chat 117: July 2023 EDA Software Market Update
|
Jul 10, 2023 |
|
RM 122: The Integration of AI into Inspection Systems
|
Jun 28, 2023 |
|
PCB Chat 116: John Watson on PCB Designer Training
|
Jun 13, 2023 |
|
RM 120: Making Reliability Training Entertaining and Effective
|
Jun 01, 2023 |
|
RM 119: Quantum Mechanics Explained
|
May 11, 2023 |
|
PCB Chat 115: Wally Rhines on the Latest ECAD Market Data
|
May 10, 2023 |
|
PCB Chat 114: Matthias Wagner and Kerry Chayka of Flux
|
Apr 28, 2023 |
|
RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble
|
Apr 26, 2023 |
|
RM 117: When Residues Cause Circuit Assemblies to Fail
|
Apr 12, 2023 |
|
RM 116: Supply Chain Musings with Mark Godwin of Ventec
|
Apr 07, 2023 |
|
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
|
Mar 31, 2023 |
|
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
|
Mar 23, 2023 |
|
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
|
Mar 17, 2023 |
|
RM 115: Making Sense of ’Big Data’
|
Mar 14, 2023 |
|
PCB Chat 110: Steve Robinson of APCT
|
Mar 14, 2023 |
|
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
|
Mar 08, 2023 |
|
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
|
Feb 09, 2023 |
|
Business Challenges with STI Electronics’ President David Raby
|
Feb 02, 2023 |
|
PCB Chat 109: Wally Rhines on the PCB Design Software Market
|
Jan 31, 2023 |
|
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
|
Jan 27, 2023 |
|
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
|
Jan 26, 2023 |
|
RM 111: Liquid Metal’s Potential Future in Electronics
|
Jan 10, 2023 |
|
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
|
Dec 19, 2022 |
|
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
|
Dec 07, 2022 |
|
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
|
Dec 05, 2022 |
|
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
|
Nov 28, 2022 |
|
RM 107: IPC Validation Services & the Trusted Supplier Program
|
Nov 08, 2022 |
|
RM 106: A Conversation about Production Automation
|
Oct 25, 2022 |
|
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
|
Oct 18, 2022 |
|
RM 105: Conformal Coating Material Selection Best Practices
|
Oct 17, 2022 |
|
PCB Chat 104: Wang Lu of Jove Enterprises
|
Sep 27, 2022 |
|
RM 104: Thomas Ricciardelli on ESD Flooring
|
Sep 20, 2022 |
|
PCB Chat 103: Stephen Chavez on Design Automation
|
Sep 13, 2022 |
|
RM 103: SMT Assembly Equipment for Low-Volume Applications
|
Sep 13, 2022 |
|
RM 102: Contract Manufacturer Selection Process Best Practices
|
Aug 23, 2022 |
|
RM 101: The Future of US Manufacturing with IPC’s Matt Kelly
|
Aug 09, 2022 |
|
RM 100: A 100th Episode Special (Recorded Live)
|
Aug 09, 2022 |
|
PCB Chat 102: Dr. Matthew Dyson on the Factory of the Future
|
Jul 21, 2022 |
|
PCB Chat 101: Brian Morrison on Smart Manufacturing
|
Jul 19, 2022 |
|
RM 99: Graham Naisbitt on IPC Cleanliness Standard Compliance
|
Jul 12, 2022 |
|
PCB Chat 100: John Burkhert Jr. on Engineering Soft Skills
|
Jul 06, 2022 |
|
RM 98: Jen Fijalkowski on Advances in Solder Pastes
|
Jun 30, 2022 |
|
PCB Chat 99: RIT PCB Design Curriculum
|
Jun 20, 2022 |
|
RM 97: Best Practices for Purchasing X-Ray Equipment
|
Jun 16, 2022 |
|
RM 96: Phil Zarrow and Jim Hall on Their New Book
|
May 27, 2022 |
|
PCB Chat 98: The Cadence Allegro/ Dassault Systèmes 3DExperience Integration
|
May 18, 2022 |
|
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
|
May 11, 2022 |
|
RM 95: SMTA SMT Certification Course Authors Dr. Ron Lasky and Jim Hall
|
May 09, 2022 |
|
RM 94: Dr. Ron Lasky on His Many Books
|
Apr 28, 2022 |
|
RM 93: Dr. Kunal Shah on Ni-Less ENIG
|
Apr 20, 2022 |
|
PCB Chat 96: The Latest HDP Initiatives with Jack Fisher and Madan Jagernauth
|
Apr 12, 2022 |
|
PCB Chat 95: Latest PCB ECAD Market Data with Wally Rhines
|
Apr 04, 2022 |
|
RM 92: IPC Apex Expo Conversations: Reflow Thermal Control / Automated Device Programming
|
Mar 23, 2022 |
|
RM 91: Conversations from IPC APEX Expo - Inspection Systems - Contract Assembly - and Pirates!
|
Mar 17, 2022 |
|
PCB Chat 94: Michael Kirschner on Sustainability Standards
|
Mar 10, 2022 |
|
RM 90: Mike Adamson on Component Storage
|
Feb 24, 2022 |
|
PCB Chat 93: Mack Technologies on EMS Manufacturing in Mexico
|
Feb 14, 2022 |
|
RM 89: Tombstoning Mitigation with Tony Lentz
|
Feb 08, 2022 |
|
PCB Chat 92: Dr. James Lee and Chris Banton on RIT’s PCB Design Curriculum
|
Feb 03, 2022 |
|
RM 88: Indium’s Brian O’Leary on Electric Vehicles
|
Jan 28, 2022 |
|
PCB Chat 91: Wally Rhines on the Latest ECAD Software Trends
|
Jan 19, 2022 |
|
PCB Chat 90: Travis Kelly on the PCBAA
|
Jan 13, 2022 |
|
RM 84: Christopher Frederickson on Solder Paste Inspection
|
Dec 16, 2021 |
|
PCB Chat 89: College Training Programs for Electronics
|
Dec 10, 2021 |
|
PCB Chat 88: HDP Users Group Update
|
Dec 01, 2021 |
|
C2C 12: Smart Splice Cofounder Larry Welk
|
Dec 01, 2021 |
|
RM 83: Thermal Management Expert Miles Moreau
|
Nov 24, 2021 |