The EEcosystem Podcast
By Judy Warner
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Category: Technology
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Subscribers: 3
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Episodes: 61
Description
Welcome to The EEcosystem Podcast, a podcast for Electrical Engineers who design and develop advanced technology applications. Each week we feature conversations with experts and subject matter experts that will help you navigate your design across all disciplines and stakeholders through a systems-based perspective. Subjects discussed are packaging, components, supply chain, materials, PCB design, fab, assembly, SI/PI/EMI, RF/MW/mmWave, embedded systems, test and measurement, and more. For more information, please visit our website for more technical resources and to join our online engineering community: https://theeecosytem.com.
| Episode | Date |
|---|---|
|
Engineering Salary and Career Insights: How Much Should you be Making?
|
Mar 19, 2024 |
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Effectively designing a Power Delivery System with Expert Lee Ritchey
|
Feb 28, 2024 |
|
A Pre-game Coverage of Samtec at DesignCon and The New Era of High-Speed Connectivity
|
Jan 24, 2024 |
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DesignCon 2024: Behind the Scenes Sneak Peek
|
Jan 24, 2024 |
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Expert Memory Design and Implementation
|
Jan 11, 2024 |
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Product Design Process | Navigating the Electronics Engineer’s Journey with Ben Dannan & Heesoo Lee
|
Jan 02, 2024 |
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VNA: Insights into Time & Frequency Domains | Jason Ellison (Rohde & Schwarz)
|
Dec 19, 2023 |
|
The Father of IBIS Shares his SI Cheat Sheet
|
Dec 12, 2023 |
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”Chips Don’t Float!” Updates on Strengthening the US PCB Supply Chain
|
Nov 29, 2023 |
|
Accurate 3D EM Analysis With a Click of Button | Know How ? Expert - Yuriy Shlepnev (Simberian Inc.)
|
Nov 21, 2023 |
|
Circuit Architecture to Schmatic in 60 Seconds
|
Nov 03, 2023 |
|
PCB Design for Manufacturing (DFM) & Handoff Mistakes to Avoid | Laura Martin, PCB DfM Expert
|
Oct 18, 2023 |
|
Satellites, 5G, Open RAN, PCI6, Chat GPT and Beyond: Samtec’s Expert on High-Speed Tech! - Matt Burns
|
Oct 09, 2023 |
|
Ben Dannan: What is enough VDDQ Package PI Analysis for DDR4/5
|
Oct 01, 2023 |
|
Signal Integrity | Impedence Modeling | AI in EDA Tools | Expert - Bert Simonowich
|
Sep 28, 2023 |
|
EMI and EMC Testing | Simulation | Standards | Expert Insights - Juliano Mologni
|
Sep 20, 2023 |
|
EDI CON 2023: Conference Preview
|
Sep 13, 2023 |
|
Power Integrity Everywhere: From Space to TikTok
|
Sep 06, 2023 |
|
The Signal Integrity Workflow Evolution
|
Aug 08, 2023 |
|
Next-Gen Software-Defined PCB Design for Hardware Designers
|
Jul 24, 2023 |
|
PCB Industry Visits Capitol Hill and the Impact to Engineers
|
Jul 18, 2023 |
|
Understanding and Mitigating Board Level Skew
|
Jul 11, 2023 |
|
Onsite Insights IMS 2023: RF Test & Measurement for ”Every Bench”
|
Jun 23, 2023 |
|
Onsite Insights IMS 2023: Jim Alexander, Samtec
|
Jun 23, 2023 |
|
Onsite Insights IMS 2023: Daren McClearnon, Keysight
|
Jun 23, 2023 |
|
Onsite Insights IMS 2023: John Coonrod, Rogers Corporation
|
Jun 20, 2023 |
|
Onsite Insights IMS 2023: Laura Martin, Summit Interconnect
|
Jun 20, 2023 |
|
Pushing the Limits of High Frequency Interconnect Technology
|
Jun 10, 2023 |
|
What to Expect at the International Microwave Symposium (IMS) 2023
|
Jun 06, 2023 |
|
How Your PCB Manufacturer Can Drive Your Success
|
May 26, 2023 |
|
Signal Integrity 101: Fundmentals for Professional Engineers
|
May 17, 2023 |
|
How to Become a Full-Stack Hardware Engineer
|
May 09, 2023 |
|
Dr. Alex Lidow: The Mind Behind the Power MOSFET and the rise of eGaN©
|
Apr 13, 2023 |
|
Systems Engineering with an Aviators ”Mission” Mindset (Pt 1)
|
Mar 22, 2023 |
|
Cracking the EMC Code: Troubleshooting Tips from the Workbench
|
Mar 08, 2023 |
|
Hardware and Signal Integrity Efficient Design Flow
|
Feb 28, 2023 |
|
Navigating the Pitfalls of RF/MW and mmWave PCB Design, Fab and Assembly
|
Feb 13, 2023 |
|
Lee Ritchey & Avishtech Founders on Simulation-Based Design Stack Up
|
Feb 13, 2023 |
|
Ben Dannan: The Value of Investing in Your Career at DesignCon
|
Feb 09, 2023 |
|
Advancements in Memory, Virtual Simulation, and Enabling Design for Context from Keysight
|
Feb 08, 2023 |
|
Boston Dynamics Keynote Inspires with Insight, Passion, and His Robot Dog ”Spot” at DesignCon 2023
|
Feb 07, 2023 |
|
How to Pass EMC the First Time, Every Time
|
Jan 27, 2023 |
|
Game-Changing Modeling and Simulation for your PCB Stack-Up
|
Jan 26, 2023 |
|
Paving the Road to 224G: Preview of Samtec’s Enabling Technologies for DesignCon
|
Jan 25, 2023 |
|
VRM Modeling & Simulations for Power Integrity that are Accurate, Simple to do and Blazingly Fast!
|
Jan 24, 2023 |
|
DesignCon 2023: A Sneak-Peek of The Super Bowl of High-Speed Electronics
|
Jan 17, 2023 |
|
PCBAA: Taking the Fight for a Secure Supply Chain to Washington, DC.
|
Jan 10, 2023 |
|
PCB Design Expert Hosts the New PCB Design Podcast
|
Dec 20, 2022 |
|
All About Probes and Ensuring Accurate Measurements
|
Dec 13, 2022 |
|
Growing RF Interconnect Design Challenges and Solutions
|
Oct 18, 2022 |
|
Navigating Grounding and EMI issues in your PCBs and PCB West Sneak Peek
|
Sep 30, 2022 |
|
SIGLENT: Everyday Test and Measurement Solutions and Why Every Bench Needs Them
|
Sep 27, 2022 |
|
BONUS EPISODE: Eric Bogatin announces online Transmission 101 Class!
|
Sep 08, 2022 |
|
DDR5 Memory Standards, Simulation and Design
|
Sep 07, 2022 |
|
Why your RF/MW/mmWave PCB Simulations Don’t Match your Performance Measurements
|
Aug 29, 2022 |
|
Robert Feranec: A Decade of Innovation in Online Hardware Education
|
Jul 12, 2022 |
|
Steve Sandler’s Non-Invasive Measurement Tool (NISM and his new PI & Measurement Masterclass
|
Jul 06, 2022 |
|
Shift Left: How Measurement can Improve Design Success
|
Jun 17, 2022 |
|
Bridging the Gaps Between RF and High-Speed Digital Connector Technology
|
Jun 16, 2022 |
|
Rogers IMS Highlights: New 3D Printable RF Dielectric, Copper and Coplanar Waveguides
|
Jun 15, 2022 |
|
Dr. Eric Bogatin: 100+ PCB Design Guidelines to Minimize Signal Integrity Problems
|
Jun 13, 2022 |