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| Episode | Date |
|---|---|
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Stop Wasting Time in Datasheets: Finally an AI tool that actually helps PCB Designer
|
May 12, 2026 |
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Why “Chips Don’t Float”: The Critical Role of PCB Manufacturing in the U.S.
|
Apr 09, 2026 |
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DesignCon 2026 Kick-Off: Chiplet 3D Interconnect Designer from Keysight
|
Mar 20, 2026 |
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DesignCon 2026: Kick-Off Episode with the Dream Team of Power Integrity
|
Mar 20, 2026 |
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CAD Tools that Scale with Engineers
|
Mar 20, 2026 |
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Why Proximity, Security, and the Future of PCB Supply Chain Matters
|
Mar 20, 2026 |
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PCB Design Unrest: Who is going to Fill the Mid-Tier Gap?
|
Mar 20, 2026 |
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224 Gbps and Beyond: The State of High-Speed Electronic 2025-2026 and Beyond
|
Mar 20, 2026 |
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PCBAA Update: Why American PCB Fabrication is Crucial for Engineers and Industry
|
Dec 18, 2025 |
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PCB Design Unrest: How Siemens is Filling the Mid-Tier EDA Gap
|
Dec 09, 2025 |
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Navigating the PCB Mfg. Landscape Heading Into PCB West 2025
|
Sep 30, 2025 |
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Can your Phone Call Space? From 5GTN to 6GNTN and the Digital Twin Revolution
|
Sep 23, 2025 |
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First Principles, SpaceX Lessons, and the Future of PCB Design with AI
|
Sep 16, 2025 |
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Strengthening U.S. Electronics: Supply Chains, Workforce & Innovation with David Schild
|
Sep 09, 2025 |
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Siemens and Microchip Partner to Unleash New Design Workflow
|
Aug 25, 2025 |
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NEW High-Speed Digital Design Masterclass with Eric Bogatin
|
Aug 21, 2025 |
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AI, Power Integrity and, the Future of Engineering
|
Jun 10, 2025 |
|
Why Glass Core is the Next Leap in High-Speed Design
|
Jun 03, 2025 |
|
Evolved Engineering: Eli Hughes on the New Era of Embedded Development
|
May 13, 2025 |
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100th Episode Special: Launching Transmission Lines 101 and a New Masterclass Series with Eric Bogatin
|
Apr 29, 2025 |
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AI Innovation in PCB Design and Manufacturing
|
Apr 28, 2025 |
|
Engineering Workflow at the Velocity of Innovation
|
Apr 15, 2025 |
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Tariffs, Turbulence & Tactics: How to Ensure Supply Chain Resilience
|
Apr 01, 2025 |
|
High-Speed Interconnects: Copper or Fiber?
|
Mar 18, 2025 |
|
Signal Integrity in Practice
|
Mar 11, 2025 |
|
From Drone Racing to Disrupting the Military UAV Industry
|
Mar 05, 2025 |
|
USA PCB Supply Chain Updates from Capitol Hill
|
Feb 26, 2025 |
|
Technological Innovation of Interconnects
|
Jan 28, 2025 |
|
AI Design Innovation Trends and IndustryTrajectory in 2025
|
Jan 24, 2025 |
|
PDN and Power Integrity Master Class at DesignCon 2025
|
Jan 23, 2025 |
|
DesignCon 2025 Preview
|
Jan 22, 2025 |
|
AI Hardware Systems: Unprecedented Innovation & Disruption DesignCon 2025
|
Jan 21, 2025 |
|
AI-Enabled Data Analytics for Semi and Systems Workflow
|
Jan 09, 2025 |
|
Post Election Update: PCB Industry and Supply Chain
|
Dec 18, 2024 |
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The State of the US PCB Industry
|
Dec 17, 2024 |
|
Mastering Supply Chain Risk with AI-Driven Data Intelligence
|
Dec 13, 2024 |
|
AI and NLP Powered Part Sourcing: Made by EEs for EE’s
|
Dec 10, 2024 |
|
The AI Shift: Redefining RF, HSD, and Data Center Design
|
Dec 02, 2024 |
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New AI-Enabled Era of Part Sourcing at Scale
|
Nov 26, 2024 |
|
AI-Assisted Schematics: From Thoughts to Circuits in Minutes
|
Nov 21, 2024 |
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Your Ideal AI-Powered Workflow for Hardware Engineers
|
Nov 12, 2024 |
|
Accelerating Your Design Cycle with Innovative DfA Practices
|
Nov 06, 2024 |
|
Bridging the Gap of HSD and RF PCB Materials
|
Oct 24, 2024 |
|
Masterclass LIVE: A Critical Paradigm Shift for Signal Integrity in Practice
|
Sep 13, 2024 |
|
2000 Amp Data Centers & AI: The Future of Power & Innovation (Steve Sandler at DesignCon 2024)
|
Sep 13, 2024 |
|
Accelerating Your Chip Design IP and Data Management Workflow
|
Sep 13, 2024 |
|
Innovation and Trends in ADC Sensor Technology
|
Sep 05, 2024 |
|
How to Navigate the Complexities of 3D RF Module Design (SiP)
|
Aug 20, 2024 |
|
Is Your Component Data Intelligence Really Intelligent?
|
Aug 02, 2024 |
|
Mastering Stability and Reliability of RF/MW Cable Technologies
|
Jul 26, 2024 |
|
Chiplets: The Future of Semiconductor Design with Steven Slater
|
Jul 26, 2024 |
|
Engineering Salary and Career Insights: How Much Should you be Making?
|
Mar 19, 2024 |
|
Effectively designing a Power Delivery System with Expert Lee Ritchey
|
Feb 28, 2024 |
|
A Pre-game Coverage of Samtec at DesignCon and The New Era of High-Speed Connectivity
|
Jan 24, 2024 |
|
DesignCon 2024: Behind the Scenes Sneak Peek
|
Jan 24, 2024 |
|
Expert Memory Design and Implementation
|
Jan 11, 2024 |
|
Product Design Process | Navigating the Electronics Engineer’s Journey with Ben Dannan & Heesoo Lee
|
Jan 02, 2024 |
|
VNA: Insights into Time & Frequency Domains | Jason Ellison (Rohde & Schwarz)
|
Dec 19, 2023 |
|
The Father of IBIS Shares his SI Cheat Sheet
|
Dec 12, 2023 |
|
”Chips Don’t Float!” Updates on Strengthening the US PCB Supply Chain
|
Nov 29, 2023 |
|
Accurate 3D EM Analysis With a Click of Button | Know How ? Expert - Yuriy Shlepnev (Simberian Inc.)
|
Nov 21, 2023 |
|
Circuit Architecture to Schmatic in 60 Seconds
|
Nov 03, 2023 |
|
PCB Design for Manufacturing (DFM) & Handoff Mistakes to Avoid | Laura Martin, PCB DfM Expert
|
Oct 18, 2023 |
|
Satellites, 5G, Open RAN, PCI6, Chat GPT and Beyond: Samtec’s Expert on High-Speed Tech! - Matt Burns
|
Oct 09, 2023 |
|
Ben Dannan: What is enough VDDQ Package PI Analysis for DDR4/5
|
Oct 01, 2023 |
|
Signal Integrity | Impedence Modeling | AI in EDA Tools | Expert - Bert Simonowich
|
Sep 28, 2023 |
|
EMI and EMC Testing | Simulation | Standards | Expert Insights - Juliano Mologni
|
Sep 20, 2023 |
|
EDI CON 2023: Conference Preview
|
Sep 13, 2023 |
|
Power Integrity Everywhere: From Space to TikTok
|
Sep 06, 2023 |
|
The Signal Integrity Workflow Evolution
|
Aug 08, 2023 |
|
Next-Gen Software-Defined PCB Design for Hardware Designers
|
Jul 24, 2023 |
|
PCB Industry Visits Capitol Hill and the Impact to Engineers
|
Jul 18, 2023 |
|
Understanding and Mitigating Board Level Skew
|
Jul 11, 2023 |
|
Onsite Insights IMS 2023: RF Test & Measurement for ”Every Bench”
|
Jun 23, 2023 |
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Onsite Insights IMS 2023: Jim Alexander, Samtec
|
Jun 23, 2023 |
|
Onsite Insights IMS 2023: Daren McClearnon, Keysight
|
Jun 23, 2023 |
|
Onsite Insights IMS 2023: John Coonrod, Rogers Corporation
|
Jun 20, 2023 |
|
Onsite Insights IMS 2023: Laura Martin, Summit Interconnect
|
Jun 20, 2023 |
|
Pushing the Limits of High Frequency Interconnect Technology
|
Jun 10, 2023 |
|
What to Expect at the International Microwave Symposium (IMS) 2023
|
Jun 06, 2023 |
|
How Your PCB Manufacturer Can Drive Your Success
|
May 26, 2023 |
|
Signal Integrity 101: Fundmentals for Professional Engineers
|
May 17, 2023 |
|
How to Become a Full-Stack Hardware Engineer
|
May 09, 2023 |
|
Dr. Alex Lidow: The Mind Behind the Power MOSFET and the rise of eGaN©
|
Apr 13, 2023 |
|
Systems Engineering with an Aviators ”Mission” Mindset (Pt 1)
|
Mar 22, 2023 |
|
Cracking the EMC Code: Troubleshooting Tips from the Workbench
|
Mar 08, 2023 |
|
Hardware and Signal Integrity Efficient Design Flow
|
Feb 28, 2023 |
|
Navigating the Pitfalls of RF/MW and mmWave PCB Design, Fab and Assembly
|
Feb 13, 2023 |
|
Lee Ritchey & Avishtech Founders on Simulation-Based Design Stack Up
|
Feb 13, 2023 |
|
Ben Dannan: The Value of Investing in Your Career at DesignCon
|
Feb 09, 2023 |
|
Advancements in Memory, Virtual Simulation, and Enabling Design for Context from Keysight
|
Feb 08, 2023 |
|
Boston Dynamics Keynote Inspires with Insight, Passion, and His Robot Dog ”Spot” at DesignCon 2023
|
Feb 07, 2023 |
|
How to Pass EMC the First Time, Every Time
|
Jan 27, 2023 |
|
Game-Changing Modeling and Simulation for your PCB Stack-Up
|
Jan 26, 2023 |
|
Paving the Road to 224G: Preview of Samtec’s Enabling Technologies for DesignCon
|
Jan 25, 2023 |
|
VRM Modeling & Simulations for Power Integrity that are Accurate, Simple to do and Blazingly Fast!
|
Jan 24, 2023 |
|
DesignCon 2023: A Sneak-Peek of The Super Bowl of High-Speed Electronics
|
Jan 17, 2023 |
|
PCBAA: Taking the Fight for a Secure Supply Chain to Washington, DC.
|
Jan 10, 2023 |
|
PCB Design Expert Hosts the New PCB Design Podcast
|
Dec 20, 2022 |
|
All About Probes and Ensuring Accurate Measurements
|
Dec 13, 2022 |